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DATA SHEET
MOS FIELD EFFECT TRANSISTOR
NP82N055ELE, NP82N055KLE NP82N055CLE, NP82N055DLE, NP82N055MLE, NP82N055NLE
SWITCHING N-CHANNEL POWER MOS FET
DESCRIPTION
These products are N-channel MOS Field Effect Transistors designed for high current switching applications.
ORDERING INFORMATION
PART NUMBER NP82N055ELE-E1-AY NP82N055ELE-E2-AY NP82N055KLE-E1-AY NP82N055KLE-E2-AY
Note1, 2 Note1, 2 Note1 Note1 Note1, 2 Note1, 2 Note1 Note1
LEAD PLATING
PACKING
PACKAGE TO-263 (MP-25ZJ) typ. 1.4 g
Pure Sn (Tin)
Tape 800 p/reel TO-263 (MP-25ZK) typ. 1.5 g
NP82N055CLE-S12-AZ NP82N055DLE-S12-AY NP82N055MLE-S18-AY NP82N055NLE-S18-AY
Sn-Ag-Cu Tube 50 p/tube
TO-220 (MP-25) typ. 1.9 g TO-262 (MP-25 Fin Cut) typ. 1.8 g TO-220 (MP-25K) typ. 1.9 g TO-262 (MP-25SK) typ. 1.8 g
Pure Sn (Tin)
Notes 1. Pb-free (This product does not contain Pb in the external electrode.) 2. Not for new design
(TO-220)
FEATURES
* Channel temperature 175 degree rated * Super low on-state resistance RDS(on)1 = 8.4 m MAX. (VGS = 10 V, ID = 41 A) RDS(on)2 = 11 m MAX. (VGS = 5.0 V, ID = 41 A) RDS(on)3 = 12 m MAX. (VGS = 4.5 V, ID = 41 A) * Low input capacitance Ciss = 4400 pF TYP. * Built-in gate protection diode (TO-262)
(TO-263)
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information.
Document No. D14098EJ6V0DS00 (6th edition) Date Published October 2007 NS Printed in Japan
1999, 2000, 2007
The mark shows major revised points. The revised points can be easily searched by copying an "" in the PDF file and specifying it in the "Find what:" field.
NP82N055ELE, NP82N055KLE, NP82N055CLE, NP82N055DLE, NP82N055MLE, NP82N055NLE
ABSOLUTE MAXIMUM RATINGS (TA = 25C)
Drain to Source Voltage (VGS = 0 V) Gate to Source Voltage (VDS = 0 V) Drain Current (DC) (TC = 25C) Drain Current (Pulse)
Note2 Note1
VDSS VGSS ID(DC) ID(pulse) PT PT Tch Tstg
55 20 82 300 163 1.8 175 -55 to +175 72/50/17 51/250/289
V V A A W W C C A mJ
Total Power Dissipation (TC = 25C) Total Power Dissipation (TA = 25C) Channel Temperature Storage Temperature Single Avalanche Current Single Avalanche Energy
Note3 Note3
IAS EAS
Notes 1. Calculated constant current according to MAX. allowable channel temperature. 2. PW 10 s, Duty cycle 1% 3. Starting Tch = 25C, VDD = 28 V, RG = 25 , VGS = 20 0 V (see Figure 4.)
THERMAL RESISTANCE
Channel to Case Thermal Resistance Channel to Ambient Thermal Resistance Rth(ch-C) Rth(ch-A) 0.92 83.3 C/W C/W
2
Data Sheet D14098EJ6V0DS
NP82N055ELE, NP82N055KLE, NP82N055CLE, NP82N055DLE, NP82N055MLE, NP82N055NLE
ELECTRICAL CHARACTERISTICS (TA = 25C)
CHARACTERISTICS Zero Gate Voltage Drain Current Gate Leakage Current Gate to Source Threshold Voltage Forward Transfer Admittance Drain to Source On-state Resistance SYMBOL IDSS IGSS VGS(th) | yfs | RDS(on)1 RDS(on)2 RDS(on)3 Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Total Gate Charge Ciss Coss Crss td(on) tr td(off) tf QG1 QG2 Gate to Source Charge Gate to Drain Charge Body Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge QGS QGD VF(S-D) trr Qrr ID = 82 A, VDD = 44 V, VGS = 10 V VDD = 44 V, VGS = 5.0 V, ID = 82 A IF = 82 A, VGS = 0 V IF = 82 A, VGS = 0 V, di/dt = 100 A/s TEST CONDITIONS VDS = 55 V, VGS = 0 V VGS = 20 V, VDS = 0 V VDS = VGS, ID = 250 A VDS = 10 V, ID = 41 A VGS = 10 V, ID = 41 A VGS = 5.0 V, ID = 41 A VGS = 4.5 V, ID = 41 A VDS = 25 V, VGS = 0 V, f = 1 MHz VDD = 28 V, ID = 41 A, VGS = 10 V, RG = 1 1.5 24 2.0 50 6.7 7.9 8.4 4400 550 270 28 16 92 18 80 45 15 24 1.0 47 66 8.4 11 12 6600 830 490 61 39 180 45 120 68 MIN. TYP. MAX. 10 10 2.5 UNIT
A A
V S m m m pF pF pF ns ns ns ns nC nC nC nC V ns nC
TEST CIRCUIT 1 AVALANCHE CAPABILITY
D.U.T. RG = 25 PG. VGS = 20 0 V 50
TEST CIRCUIT 2 SWITCHING TIME
D.U.T.
L VDD PG. RG
VGS RL VDD VDS
90% 90% 10% 10%
VGS
Wave Form
0
10%
VGS
90%
BVDSS IAS ID VDD VDS
VGS 0 = 1 s Duty Cycle 1%
VDS
VDS
Wave Form
0 td(on) ton
tr
td(off) toff
tf
Starting Tch
TEST CIRCUIT 3 GATE CHARGE
D.U.T. IG = 2 mA PG. 50
RL VDD
Data Sheet D14098EJ6V0DS
3
NP82N055ELE, NP82N055KLE, NP82N055CLE, NP82N055DLE, NP82N055MLE, NP82N055NLE
TYPICAL CHARACTERISTICS (TA = 25C)
Figure1. DERATING FACTOR OF FORWARD BIAS SAFE OPERATING AREA Figure2. TOTAL POWER DISSIPATION vs. CASE TEMPERATURE 175
PT - Total Power Dissipation - W
dT - Percentage of Rated Power - %
100 80 60 40 20 0
150 125 100 75 50 25 0 0 25 50 75 100 125 150 175 200
0
25
50
75
100 125 150 175 200
TC - Case Temperature - C
TC - Case Temperature - C
Figure.3 FORWARD BIAS SAFE OPERATING AREA 1000
PW
10 0
Figure4. SINGLE AVALANCHE ENERGY DERATING FACTOR 350
EAS - Single Avalanche Energy - mJ
ID(pulse)
ID - Drain Current - A
100
R (V
) (on DS S G
d ite ) Lim V 10 =
=1
s
ID(DC)
Po Lim wer ite Dis d s DC ipa
0 s
300 289 mJ 250 200 150 100 50
51 mJ 250 mJ IAS = 17 A 50 A 72 A
1m
s
tio
n
10
1
TC = 25C 0.1 Single Pulse 1 0.1
10
100
0 25
50
75
100
125
150
175
VDS - Drain to Source Voltage - V
Starting Tch - Starting Channel Temperature - C
Figure5. TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH 1000
rth(t) - Transient Thermal Resistance - C/W
100
Rth(ch-A) = 83.3C/W
10
1
Rth(ch-C) = 0.92C/W
0.1 Single Pulse 0.01 10 100 1m 10 m 100 m 1 10 100 1000
PW - Pulse Width - s
4
Data Sheet D14098EJ6V0DS
NP82N055ELE, NP82N055KLE, NP82N055CLE, NP82N055DLE, NP82N055MLE, NP82N055NLE
Figure6. FORWARD TRANSFER CHARACTERISTICS 1000 Pulsed
Figure7. DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE 300
VGS = 10 V
ID - Drain Current - A
ID - Drain Current - A
100
TA = 175C 150C 75C 25C -55C
250 200 150
5.0 V
10
4.5 V
100 50
1
0.1 1
2
3
4
5
6
0
Pulsed
0 1 2 3 4 VDS - Drain to Source Voltage - V
VGS - Gate to Source Voltage - V
10
TA = -55C 25C 75C 175C
1
RDS(on) - Drain to Source On-state Resistance - m
| yfs | - Forward Transfer Admittance - S
Figure8. FORWARD TRANSFER ADMITTANCE vs. DRAIN CURRENT 100 VDS = 10 V Pulsed
Figure9. DRAIN TO SOURCE ON-STATE RESISTANCE vs. GATE TO SOURCE VOLTAGE 20 Pulsed
10
ID = 41 A
0.1
0.01 0.01
0.1
1
10
100
0 0 5 10 15 20 VGS - Gate to Source Voltage - V
ID - Drain Current - A
RDS(on) - Drain to Source On-state Resistance - m
20
Pulsed
VGS(th) - Gate to Source Threshold Voltage - V
Figure10. DRAIN TO SOURCE ON-STATE RESISTANCE vs. DRAIN CURRENT
Figure11. GATE TO SOURCE THRESHOLD VOLTAGE vs. CHANNEL TEMPERATURE 3.0 VDS = VGS ID = 250 A 2.5 2.0 1.5 1.0 0.5 0 -50
10
VGS = 4.5 V 5.0 V 10 V
0
1
10
100
1000
0
50
100
150
ID - Drain Current - A
Tch - Channel Temperature - C
Data Sheet D14098EJ6V0DS
5
NP82N055ELE, NP82N055KLE, NP82N055CLE, NP82N055DLE, NP82N055MLE, NP82N055NLE
RDS(on) - Drain to Source On-state Resistance - m
IF - Diode Forward Current - A
Figure12. DRAIN TO SOURCE ON-STATE RESISTANCE vs. CHANNEL TEMPERATURE 18 Pulsed 16 14 12 10 8 6 4 2 0 -50 0 50 100 ID = 41 A 150 VGS = 4.5 V 5.0 V 10 V
Figure13. SOURCE TO DRAIN DIODE FORWARD VOLTAGE 1000 Pulsed
100
VGS = 10 V
10
0V
1
0.1 0
Tch - Channel Temperature - C
1.0 0.5 VF(S-D) - Source to Drain Voltage - V
1.5
Figure14. CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE
Ciss, Coss, Crss - Capacitance - pF
VGS = 0 V f = 1 MHz
Figure15. SWITCHING CHARACTERISTICS 1000
td(on), tr, td(off), tf - Switching Time - ns
100000
tf td(off) td(on) 10 tr VDD = 28 V VGS = 10 V RG = 1 1 10 100 ID - Drain Current - A
100
10000
Ciss
1000
Coss Crss
100 0.1
1 0.1
1
10
100
VDS - Drain to Source Voltage - V
Figure16. REVERSE RECOVERY TIME vs. DIODE FORWARD CURRENT 1000
Figure17. DYNAMIC INPUT/OUTPUT CHARACTERISTICS 80
VDS - Drain to Source Voltage - V
70 60 50 40 30 20 10 0 0 10 20
VDS ID = 82 A VGS VDD = 44 V 28 V 11 V
14 12 10 8 6 4 2 40 50 60 70 80 0
100
10
1 0.1
1.0
10
100
30
IF - Diode Forward Current - A
QG - Gate Charge - nC
6
Data Sheet D14098EJ6V0DS
VGS - Gate to Source Voltage - V
trr - Reverse Recovery Time - ns
di/dt = 100 A/s VGS = 0 V
16
NP82N055ELE, NP82N055KLE, NP82N055CLE, NP82N055DLE, NP82N055MLE, NP82N055NLE

PACKAGE DRAWINGS (Unit: mm)
1)TO-263 (MP-25ZJ)
Note
2)TO-263 (MP-25ZK)
4.8 MAX. 1.3 0.2
No plating
10 TYP. 4
1.0 0.5 8.5 0.2
10.0 0.3 7.88 MIN. 4
1.35 0.3
4.45 0.2
1.3 0.2
8.0 TYP.
9.15 0.3
15.25 0.5
0.025 to 0.25
1
2
3
5.7 0.4
1.4 0.2 0.7 0.2 2.54 TYP.
0
.5R
TY
P.
TY P.
2.54 TYP.
R 0.8
0.5 0.2
2.54
0.75 0.2
0.5
0.2
8
0 to
2.8 0.2
1.Gate 2.Drain 3.Source 4.Fin (Drain)
0.25 1 2 3 1.Gate 2.Drain 3.Source
2.5
4.Fin (Drain)
3)TO-220 (MP-25)
3.0 0.3
Note
4)TO-262 (MP-25 Fin Cut)
4.8 MAX.
Note
10.6 MAX. 10.0 TYP.
1.0 0.5
3.6 0.2
5.9 MIN.
1.3 0.2
4.8 MAX. 1.3 0.2
10 TYP.
15.5 MAX.
4 1 1.3 0.2 2 3
4 123
6.0 MAX.
1.3 0.2
12.7 MIN.
12.7 MIN.
8.5 0.2
0.75 0.1 2.54 TYP.
0.5 0.2 2.54 TYP. 1.Gate 2.Drain 3.Source 4.Fin (Drain)
2.8 0.2
0.75 0.3 2.54 TYP.
0.5 0.2 2.54 TYP. 1.Gate 2.Drain 3.Source 4.Fin (Drain)
2.8 0.2
Note Not for new design
2.54 0.25
Data Sheet D14098EJ6V0DS
7
NP82N055ELE, NP82N055KLE, NP82N055CLE, NP82N055DLE, NP82N055MLE, NP82N055NLE
5)TO-220 (MP-25K)
6)TO-262 (MP-25SK)
8.9 0.2 1.2 0.3
2.8 0.3
10.0 0.2
3.8 0.2
4.45 0.2 1.3 0.2
10.0 0.2
4.45 0.2 1.3 0.2
15.9 MAX.
6.3 0.3
4
4
3.1 0.2
12
3
13.7 0.3
13.7 0.3
1.27 0.2 0.8 0.1
1.27 0.2 0.8 0.1
3.1 0.3
0.5 0.2
123
10.1 0.3
0.5 0.2
2.54 TYP. 2.54 TYP.
2.5 0.2
2.5 0.2
2.54 TYP.
2.54 TYP.
1.Gate 2.Drain 3.Source 4.Fin (Drain)
1.Gate 2.Drain 3.Source 4.Fin (Drain)
EQUIVALENT CIRCUIT
Drain
Gate
Body Diode
Gate Protection Diode
Source
Remark
The diode connected between the gate and source of the transistor serves as a protector against ESD. When this device actually used, an additional protection circuit is externally required if a voltage exceeding the rated voltage may be applied to this device.
8
Data Sheet D14098EJ6V0DS
NP82N055ELE, NP82N055KLE, NP82N055CLE, NP82N055DLE, NP82N055MLE, NP82N055NLE

TAPE INFORMATION
There are two types (-E1, -E2) of taping depending on the direction of the device.
Draw-out side
Reel side

MARKING INFORMATION
NEC 82N055 LE
Pb-free plating marking Abbreviation of part number Lot code

RECOMMENDED SOLDERING CONDITIONS
These products should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, please contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Soldering Method Infrared reflow MP-25ZJ, MP-25ZK
Soldering Conditions Maximum temperature (Package's surface temperature): 260C or below Time at maximum temperature: 10 seconds or less Time of temperature higher than 220C: 60 seconds or less Preheating time at 160 to 180C: 60 to 120 seconds Maximum number of reflow processes: 3 times Maximum chlorine content of rosin flux (percentage mass): 0.2% or less
Recommended Condition Symbol
IR60-00-3
Wave soldering MP-25, MP-25K, MP-25SK, MP-25 Fin Cut Partial heating MP-25ZJ, MP-25ZK, MP-25K, MP-25SK Partial heating MP-25, MP-25 Fin Cut
Maximum temperature (Solder temperature): 260C or below Time: 10 seconds or less Maximum chlorine content of rosin flux: 0.2% (wt.) or less Maximum temperature (Pin temperature): 350C or below Time (per side of the device): 3 seconds or less Maximum chlorine content of rosin flux: 0.2% (wt.) or less Maximum temperature (Pin temperature): 300C or below Time (per side of the device): 3 seconds or less Maximum chlorine content of rosin flux: 0.2% (wt.) or less P300 P350 THDWS
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet D14098EJ6V0DS
9
NP82N055ELE, NP82N055KLE, NP82N055CLE, NP82N055DLE, NP82N055MLE, NP82N055NLE
* The information in this document is current as of October, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. * NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. * NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above).
M8E 02. 11-1

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